Low power, high speed multi-channel chip-to-chip interface using dielectric waveguide유전체 도파관을 이용한 멀티채널 칩투칩 저전력 고속 유선 인터페이스

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dc.contributor.advisorBae, Hyeon-Min-
dc.contributor.advisor배현민-
dc.contributor.authorSong, Ha-Il-
dc.contributor.author송하일-
dc.date.accessioned2015-04-23T06:13:44Z-
dc.date.available2015-04-23T06:13:44Z-
dc.date.issued2014-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=592413&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/196667-
dc.description학위논문(석사) - 한국과학기술원 : 전기및전자공학과, 2014.8, [ iv, 40p. ]-
dc.description.abstractThe demands for advanced interconnects expands to catch up with the increase in achievable IC speed. The old-established technologies, the electrical interconnects, are near at ends owing to its fundamental limitation caused by the skin effect. And the optical interconnects believed as a strong alternative are still under restrictions in terms of tremendous replacement cost. We have designed a completely novel type of chip-to-chip interconnects. A new interconnect, E-TUBE, would be a cost-effective/low power solution to high speed data communication. The CMOS transceiver operating at 60GHz passband transmits and receives data through the multiple dielectric waveguide channels. E-TUBE is aiming for IEEE P802.3bj KR standard and be a promising solution to the overall short reach chip-to-chip interface. A return loss is under 10dB in a frequency range of 53 to 77 GHz. The insertion loss at the center frequency of the passband is found to be 15dB for 1m waveguide. The bandwidth of the E-TUBE channel is adequately achieved to transmit PAM4 28Gbps data at center frequency of 62GHz. The area occupied by the one E-TUBE channel is 3.1mm x 1.5mm.eng
dc.languageeng-
dc.publisher한국과학기술원-
dc.subjectChip-to-Chip Interface-
dc.subjectIEEE P802.3bj KR-
dc.subject60GHz CMOS 송수신기-
dc.subject유전체 도파관-
dc.subject인터커넥트-
dc.subject칩투칩 인터페이스-
dc.subjectInterconnect-
dc.subjectE-TUBE-
dc.subjectDielectric waveguide-
dc.subject60GHz CMOS Transceiver-
dc.subjectIEEE P802.3bj KR-
dc.titleLow power, high speed multi-channel chip-to-chip interface using dielectric waveguide-
dc.title.alternative유전체 도파관을 이용한 멀티채널 칩투칩 저전력 고속 유선 인터페이스-
dc.typeThesis(Master)-
dc.identifier.CNRN592413/325007 -
dc.description.department한국과학기술원 : 전기및전자공학과, -
dc.identifier.uid020124450-
dc.contributor.localauthorBae, Hyeon-Min-
dc.contributor.localauthor배현민-
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EE-Theses_Master(석사논문)
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