DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nam, Soohyun | ko |
dc.contributor.author | Lee, Dongyoung | ko |
dc.contributor.author | Choi, Ilbeom | ko |
dc.contributor.author | Lee, Dai-Gil | ko |
dc.date.accessioned | 2015-04-07T04:32:58Z | - |
dc.date.available | 2015-04-07T04:32:58Z | - |
dc.date.created | 2015-02-05 | - |
dc.date.created | 2015-02-05 | - |
dc.date.created | 2015-02-05 | - |
dc.date.issued | 2015-02 | - |
dc.identifier.citation | COMPOSITE STRUCTURES, v.120, pp.107 - 116 | - |
dc.identifier.issn | 0263-8223 | - |
dc.identifier.uri | http://hdl.handle.net/10203/195179 | - |
dc.description.abstract | The vanadium redox flow battery (VRFB) is considered as one of the most promising energy storage system in the future. It is composed of two endplates and a stack which consists of flow frame (FF), electrode, bipolar plate (BP) and membrane. Because the electrolytes flowing in the stack are sulfuric-acid-based solutions, prevention of leakage is important. The unified structure of the FF and the BP manufactured by co-curing E-glass/epoxy and carbon/epoxy composites not only prevents leakage, but also simplifies assembling process. However, large thermal residual stress is induced due to the difference of coefficients of thermal expansion between E-glass/epoxy and carbon/epoxy composites. In this work, smart cure cycle was developed to reduce the thermal residual stress of the co-cured E-glass/carbon/epoxy structure for VRFB. The deformations of structure fabricated using smart cure cycle were investigated with respect to the degree of cure and post-cure process using the viscoelastic properties of composite materials during post-cure process. In addition, the thermal residual stress and actual bonding temperature were calculated. Using the experimental results of degree of cure and actual bonding temperature, a finite element analysis was performed to verify the stress of the co-cured FF BP structure as a function of the cure cycles. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.subject | VISCOELASTIC PROPERTIES | - |
dc.subject | BIPOLAR PLATE | - |
dc.subject | DIELECTROMETRY | - |
dc.subject | REDUCTION | - |
dc.subject | JOINTS | - |
dc.title | Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery | - |
dc.type | Article | - |
dc.identifier.wosid | 000347264800010 | - |
dc.identifier.scopusid | 2-s2.0-84921902226 | - |
dc.type.rims | ART | - |
dc.citation.volume | 120 | - |
dc.citation.beginningpage | 107 | - |
dc.citation.endingpage | 116 | - |
dc.citation.publicationname | COMPOSITE STRUCTURES | - |
dc.identifier.doi | 10.1016/j.compstruct.2014.09.037 | - |
dc.contributor.localauthor | Lee, Dai-Gil | - |
dc.contributor.nonIdAuthor | Nam, Soohyun | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Smart cure cycle | - |
dc.subject.keywordAuthor | Co-cure method | - |
dc.subject.keywordAuthor | Hybrid composite | - |
dc.subject.keywordAuthor | Thermal residual stress | - |
dc.subject.keywordAuthor | Vanadium redox flow battery (VRFB) | - |
dc.subject.keywordAuthor | Co-cured flow frame and bipolar plate | - |
dc.subject.keywordAuthor | Smart cure cycle | - |
dc.subject.keywordAuthor | Co-cure method | - |
dc.subject.keywordAuthor | Hybrid composite | - |
dc.subject.keywordAuthor | Thermal residual stress | - |
dc.subject.keywordAuthor | Vanadium redox flow battery (VRFB) | - |
dc.subject.keywordAuthor | Co-cured flow frame and bipolar plate | - |
dc.subject.keywordPlus | VISCOELASTIC PROPERTIES | - |
dc.subject.keywordPlus | BIPOLAR PLATE | - |
dc.subject.keywordPlus | DIELECTROMETRY | - |
dc.subject.keywordPlus | REDUCTION | - |
dc.subject.keywordPlus | JOINTS | - |
dc.subject.keywordPlus | VISCOELASTIC PROPERTIES | - |
dc.subject.keywordPlus | BIPOLAR PLATE | - |
dc.subject.keywordPlus | DIELECTROMETRY | - |
dc.subject.keywordPlus | REDUCTION | - |
dc.subject.keywordPlus | JOINTS | - |
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