Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.date.accessioned | 2015-01-29T05:35:53Z | - |
| dc.date.available | 2015-01-29T05:35:53Z | - |
| dc.date.created | 2014-12-24 | - |
| dc.date.issued | 2014-07-22 | - |
| dc.identifier.citation | 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/193463 | - |
| dc.language | ENG | - |
| dc.publisher | Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014) | - |
| dc.title | Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014) | - |
| dc.identifier.conferencecountry | China | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
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