Fabrication of the Packaging-Completed Flexible Electronic Device using Flip Chip Bonding Technology
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김도현 | - |
| dc.contributor.author | 이건재 | - |
| dc.date.accessioned | 2015-01-29T05:05:54Z | - |
| dc.date.available | 2015-01-29T05:05:54Z | - |
| dc.date.created | 2014-12-17 | - |
| dc.date.issued | 2014-04-10 | - |
| dc.identifier.citation | 2014년 한국고분자학회 춘계학술대회, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/193276 | - |
| dc.language | KOR | - |
| dc.publisher | 한국고분자학회 | - |
| dc.title | Fabrication of the Packaging-Completed Flexible Electronic Device using Flip Chip Bonding Technology | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2014년 한국고분자학회 춘계학술대회 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 이건재 | - |
| dc.contributor.nonIdAuthor | 김도현 | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.