Warpage analysis of electroplated Cu films on polymer based packaging core substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김철규 | ko |
| dc.contributor.author | 이태익 | ko |
| dc.contributor.author | 김민성 | ko |
| dc.contributor.author | 김택수 | ko |
| dc.date.accessioned | 2015-01-29T05:01:16Z | - |
| dc.date.available | 2015-01-29T05:01:16Z | - |
| dc.date.created | 2014-12-15 | - |
| dc.date.issued | 2014-10-14 | - |
| dc.identifier.citation | MPC2014 Autumn Symposium | - |
| dc.identifier.uri | http://hdl.handle.net/10203/193243 | - |
| dc.language | English | - |
| dc.publisher | MPC | - |
| dc.title | Warpage analysis of electroplated Cu films on polymer based packaging core substrate | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | MPC2014 Autumn Symposium | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 일산 KINTEX 세미나룸 301호 | - |
| dc.contributor.localauthor | 김택수 | - |
| dc.contributor.nonIdAuthor | 김민성 | - |
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