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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

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dc.contributor.authorKim, CGko
dc.contributor.authorLee, Tko
dc.contributor.authorKim, MSko
dc.contributor.authorKim, Taek-Sooko
dc.date.accessioned2015-01-29T04:59:08Z-
dc.date.available2015-01-29T04:59:08Z-
dc.date.created2014-12-15-
dc.date.issued2014-11-14-
dc.identifier.citationInternational Conference on Experimental Mechanics 2014-
dc.identifier.urihttp://hdl.handle.net/10203/193223-
dc.languageEnglish-
dc.publisherInternational Conference on Experimental Mechanics-
dc.titleWarpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameInternational Conference on Experimental Mechanics 2014-
dc.identifier.conferencecountrySI-
dc.identifier.conferencelocationHoliday Inn Singapore Atrium, Singapore-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.nonIdAuthorKim, CG-
dc.contributor.nonIdAuthorLee, T-
dc.contributor.nonIdAuthorKim, MS-
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ME-Conference Papers(학술회의논문)
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