Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | - |
| dc.contributor.author | R.H. Dauskardt | - |
| dc.date.accessioned | 2014-11-12 | - |
| dc.date.available | 2014-11-12 | - |
| dc.date.created | 2014-01-14 | - |
| dc.date.issued | 2009-04-26 | - |
| dc.identifier.citation | 2009 IEEE International Reliability Physics Symposium, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/191029 | - |
| dc.language | ENG | - |
| dc.publisher | IEEE | - |
| dc.title | Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2009 IEEE International Reliability Physics Symposium | - |
| dc.identifier.conferencecountry | Canada | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.nonIdAuthor | R.H. Dauskardt | - |
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