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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Thermocompression transfer printing process for improved bonding between nanowires and metal electrodes

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dc.contributor.authorPark, Inkyu-
dc.contributor.authorLee, WS-
dc.contributor.authorLee, JH-
dc.date.accessioned2014-11-12-
dc.date.available2014-11-12-
dc.date.created2014-01-15-
dc.date.issued2011-10-20-
dc.identifier.citationNanoimprint and Nanoprint Technology 2011, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/190971-
dc.languageENG-
dc.publisherNanoimprint and Nanoprint Technology 2011-
dc.titleThermocompression transfer printing process for improved bonding between nanowires and metal electrodes-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameNanoimprint and Nanoprint Technology 2011-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorPark, Inkyu-
dc.contributor.nonIdAuthorLee, WS-
dc.contributor.nonIdAuthorLee, JH-
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ME-Conference Papers(학술회의논문)
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