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Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV) Ahn, Seungyoung; Pak, Jun So; Taigon Song; Lee, Hee Jae; Jung-Gun Byun; Deogsoo Kang; Cheol-Seung Choi; et al, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.625 - 630, IEEE, 2010-07-25 |
Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
TSV mutual inductance effect on impedance of 3D stacked on-chip PDN with multi-TSV connections Pak, Jun So; Cho J.; Kim J.; Lee J.; Lee H.; Park K.; Kim J., 2010 IEEE CPMT Symposium Japan, ICSJ10, 2010-08-24 |
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