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Properties of titanium-nitride for high-level waste packaging enhancement

Scheffing, C. C.; Jagannadham, K.; Yim, Man-Sung; Bourham, M. A.; Farmer, J. C.; Haslam, J. J.; Day, S. D.; et al, NUCLEAR TECHNOLOGY, v.156, no.2, pp.213 - 221, 2006-11

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