Sharing power distribution networks for enhanced power integrity by using through-silicon-via
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Pak, J.S. | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Lee, J. | ko |
| dc.contributor.author | Lee, H. | ko |
| dc.contributor.author | Park, K. | ko |
| dc.contributor.author | Kim, J. | ko |
| dc.date.accessioned | 2010-06-16T21:38:04Z | - |
| dc.date.available | 2010-06-16T21:38:04Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-12-10 | - |
| dc.identifier.citation | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/18888 | - |
| dc.description.sponsorship | This work was supported by the IT R&D program of MIC/IITA [2005-S-118-02, Development of High- Performance and Smallest SiP Technology] and the Brain Korea 21 project [the School of Information Technology, KAIST in 2008]. | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Sharing power distribution networks for enhanced power integrity by using through-silicon-via | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000265245200003 | - |
| dc.identifier.scopusid | 2-s2.0-60649087374 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 9 | - |
| dc.citation.endingpage | 12 | - |
| dc.citation.publicationname | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Seoul | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Pak, J.S. | - |
| dc.contributor.nonIdAuthor | Lee, J. | - |
| dc.contributor.nonIdAuthor | Lee, H. | - |
| dc.contributor.nonIdAuthor | Park, K. | - |
| dc.contributor.nonIdAuthor | Kim, J. | - |
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