Thermal property of transparent silver nanowire films

Abstract

Through a comparison with transparent polymer composite films, we investigate the thermal property of transparent silver nanowire (AgNW) films that may be employed for heat sink in transparent electronic devices. To fabricate transparent polymer composite films and enhance their thermal property, poly(methyl methacrylate) (PMMA) solution featuring high transparency (similar to 90%) and thermal emissivity (0.9) is mixed with thermal conductive fillers such as aluminum nitride (AlN) and silicon carbide (SiC). It is observed that the thermal emissivity of the AgNW films is decreased as the sheet resistance is reduced. However, we have found that the AgNW film shows the most excellent heat dissipation property (53.7 degrees C) while maintaining relatively higher transparency (77.1% at 520 nm), followed by the PMMA: SiC and then PMMA: AlN films.