Melt-mediated coalescence of solution-deposited ZnO nanoparticles by excimer laser annealing for thin-film transistor fabrication

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dc.contributor.authorPan, Hengko
dc.contributor.authorMisra, Nipunko
dc.contributor.authorKo, Seung Hwanko
dc.contributor.authorGrigoropoulos, Costas P.ko
dc.contributor.authorMiller, Nateko
dc.contributor.authorHaller, Eugene E.ko
dc.contributor.authorDubon, Oscarko
dc.date.accessioned2010-06-14T20:50:33Z-
dc.date.available2010-06-14T20:50:33Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2009-01-
dc.identifier.citationAPPLIED PHYSICS A-MATERIALS SCIENCE PROCESSING, v.94, no.1, pp.111 - 115-
dc.identifier.issn0947-8396-
dc.identifier.urihttp://hdl.handle.net/10203/18844-
dc.description.abstractNanoparticle solutions are considered promising for realizing low cost printable high performance flexible electronics. In this letter, excimer laser annealing (ELA) was employed to induce melting of solution-deposited ZnO nanoparticles and form electrically conductive porous films. The properties of the films were characterized by scanning electron microscopy, high-resolution transmission electron microscopy, DC conductance, and photoluminescence measurements. Thin-film field-effect transistors have been fabricated by ELA without the use of conventional vacuum or any high temperature thermal annealing processes. The transistors show n-type accumulation mode behavior with mobility greater than 0.1 cm(2)/V s and current on/off ratios of more than 10(4). Optimization and control of the laser processing parameters minimized thermal impact on the substrate. This technique can be beneficial in the fabrication of metal oxide based electronics on heat sensitive flexible plastic substrates using low-cost, large-area solution processing combined with direct printing techniques.-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherSPRINGER-
dc.subjectROOM-TEMPERATURE-
dc.titleMelt-mediated coalescence of solution-deposited ZnO nanoparticles by excimer laser annealing for thin-film transistor fabrication-
dc.typeArticle-
dc.identifier.wosid000260937700017-
dc.identifier.scopusid2-s2.0-56349115844-
dc.type.rimsART-
dc.citation.volume94-
dc.citation.issue1-
dc.citation.beginningpage111-
dc.citation.endingpage115-
dc.citation.publicationnameAPPLIED PHYSICS A-MATERIALS SCIENCE PROCESSING-
dc.identifier.doi10.1007/s00339-008-4925-0-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKo, Seung Hwan-
dc.contributor.nonIdAuthorPan, Heng-
dc.contributor.nonIdAuthorMisra, Nipun-
dc.contributor.nonIdAuthorGrigoropoulos, Costas P.-
dc.contributor.nonIdAuthorMiller, Nate-
dc.contributor.nonIdAuthorHaller, Eugene E.-
dc.contributor.nonIdAuthorDubon, Oscar-
dc.type.journalArticleArticle-
dc.subject.keywordPlusROOM-TEMPERATURE-
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