Thermal Analysis for Temperature Robust Wireless Power Transfer Systems
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hwang, Kiwon | ko |
| dc.contributor.author | Chung, Sanghoon | ko |
| dc.contributor.author | Yoon, Uooyeol | ko |
| dc.contributor.author | Lee, Manho | ko |
| dc.contributor.author | Ahn, Seungyoung | ko |
| dc.date.accessioned | 2014-08-28T08:09:18Z | - |
| dc.date.available | 2014-08-28T08:09:18Z | - |
| dc.date.created | 2013-11-22 | - |
| dc.date.created | 2013-11-22 | - |
| dc.date.created | 2013-11-22 | - |
| dc.date.issued | 2013-05-16 | - |
| dc.identifier.citation | IEEE Wireless Power Transfer Conference, pp.52 - 55 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/188395 | - |
| dc.language | English | - |
| dc.publisher | IEEE Wireless Power Transfer Conference | - |
| dc.title | Thermal Analysis for Temperature Robust Wireless Power Transfer Systems | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000326804900013 | - |
| dc.identifier.scopusid | 2-s2.0-84881492169 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 52 | - |
| dc.citation.endingpage | 55 | - |
| dc.citation.publicationname | IEEE Wireless Power Transfer Conference | - |
| dc.identifier.conferencecountry | IT | - |
| dc.identifier.doi | 10.1109/WPT.2013.6556879 | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Ahn, Seungyoung | - |
| dc.contributor.nonIdAuthor | Hwang, Kiwon | - |
| dc.contributor.nonIdAuthor | Chung, Sanghoon | - |
| dc.contributor.nonIdAuthor | Lee, Manho | - |
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