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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Wireless Power Distribution Network for 3D Package Using Magnetic Field Resonance

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorSong, Eunseokko
dc.contributor.authorKim, Hongseokko
dc.contributor.authorSong, Chiukko
dc.contributor.authorKim, Jonghoon Jko
dc.date.accessioned2014-08-28T06:49:22Z-
dc.date.available2014-08-28T06:49:22Z-
dc.date.created2014-01-03-
dc.date.created2014-01-03-
dc.date.created2014-01-03-
dc.date.issued2013-12-13-
dc.identifier.citation2013 IEEE Electrical Design of Advanced Packaging and Systems-
dc.identifier.urihttp://hdl.handle.net/10203/188150-
dc.languageEnglish-
dc.publisher2013 IEEE Electrical Design of Advanced Packaging and Systems-
dc.titleWireless Power Distribution Network for 3D Package Using Magnetic Field Resonance-
dc.typeConference-
dc.identifier.wosid000345631500009-
dc.identifier.scopusid2-s2.0-84894205952-
dc.type.rimsCONF-
dc.citation.publicationname2013 IEEE Electrical Design of Advanced Packaging and Systems-
dc.identifier.conferencecountryJA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorSong, Eunseok-
dc.contributor.nonIdAuthorKim, Hongseok-
dc.contributor.nonIdAuthorSong, Chiuk-
dc.contributor.nonIdAuthorKim, Jonghoon J-
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