DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kam, Dona Gun | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-05-31T07:49:01Z | - |
dc.date.available | 2010-05-31T07:49:01Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.2, pp.258 - 266 | - |
dc.identifier.issn | 1521-3323 | - |
dc.identifier.uri | http://hdl.handle.net/10203/18680 | - |
dc.description.abstract | A 40-Gb/s packaging solution that uses low-cost wire-bonded plastic ball grid array (WB-PBGA) technology is presented. Since such a high speed was beyond the reach of conventional package designs, a new design methodology was proposed-discontinuity cancellation in both signal-current and return-current paths. The 3-D structures of bonding wires, vias, solder ball pads, and power distribution networks were optimized for the discontinuity cancellation. Two versions of four-layer WB-PBGA packages were designed; one according to the proposed methodology and the other conventionally. The proposed design methodology was verified with full-wave simulation, passive bandwidth measurement, time domain reflectometry (TDR), eye diagram measurement, and jitter analysis. | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | TECHNOLOGY | - |
dc.subject | CIRCUIT | - |
dc.subject | GHZ | - |
dc.title | 40-Gb/s package design using wire-bonded plastic ball grid array | - |
dc.type | Article | - |
dc.identifier.wosid | 000258768300003 | - |
dc.identifier.scopusid | 2-s2.0-44449092639 | - |
dc.type.rims | ART | - |
dc.citation.volume | 31 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 258 | - |
dc.citation.endingpage | 266 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON ADVANCED PACKAGING | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kam, Dona Gun | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | ball grid array (BGA) | - |
dc.subject.keywordAuthor | discontinuity cancellation | - |
dc.subject.keywordAuthor | high-speed serial link | - |
dc.subject.keywordAuthor | package electrical design | - |
dc.subject.keywordAuthor | power distribution network (PDN) | - |
dc.subject.keywordAuthor | return-current path | - |
dc.subject.keywordPlus | TECHNOLOGY | - |
dc.subject.keywordPlus | CIRCUIT | - |
dc.subject.keywordPlus | GHZ | - |
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