DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, J. | ko |
dc.contributor.author | Kim, H. | ko |
dc.contributor.author | Pak, J.S. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-05-31T06:02:47Z | - |
dc.date.available | 2010-05-31T06:02:47Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-02-27 | - |
dc.identifier.citation | 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, pp.328 - 331 | - |
dc.identifier.issn | 0018-9375 | - |
dc.identifier.uri | http://hdl.handle.net/10203/18671 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Characterization of SSN coupling to signal via in multi-layer PCBs and packages | - |
dc.type | Conference | - |
dc.identifier.wosid | 000244386300084 | - |
dc.identifier.scopusid | 2-s2.0-33751044126 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 328 | - |
dc.citation.endingpage | 331 | - |
dc.citation.publicationname | 17th International Zurich Symposium on Electromagnetic Compatibility, 2006 | - |
dc.identifier.conferencecountry | SI | - |
dc.identifier.conferencelocation | Singapore | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Park, J. | - |
dc.contributor.nonIdAuthor | Kim, H. | - |
dc.contributor.nonIdAuthor | Pak, J.S. | - |
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