DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, J. | ko |
dc.contributor.author | Lu, A.C.W. | ko |
dc.contributor.author | Fan, W. | ko |
dc.contributor.author | Wai, L.L. | ko |
dc.contributor.author | Chua, K.M. | ko |
dc.contributor.author | Shim, Y. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-05-31T02:46:55Z | - |
dc.date.available | 2010-05-31T02:46:55Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-05-30 | - |
dc.identifier.citation | IEEE 56th Electronic Components and Technology Conference, pp.1286 - 1289 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/18668 | - |
dc.description.sponsorship | Agency for Defense Development, Korea Radiowave Detection Research Center at KAIST, Korea Singapore Institute of Manufacturing Technology, Singapore A*STAR, Singapore | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | The scalable modeling of multi-layer embedded capacitor based on LTCC substrate | - |
dc.type | Conference | - |
dc.identifier.wosid | 000238566601028 | - |
dc.identifier.scopusid | 2-s2.0-33845586470 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1286 | - |
dc.citation.endingpage | 1289 | - |
dc.citation.publicationname | IEEE 56th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | San Diego, CA | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Park, J. | - |
dc.contributor.nonIdAuthor | Lu, A.C.W. | - |
dc.contributor.nonIdAuthor | Fan, W. | - |
dc.contributor.nonIdAuthor | Wai, L.L. | - |
dc.contributor.nonIdAuthor | Chua, K.M. | - |
dc.contributor.nonIdAuthor | Shim, Y. | - |
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