Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kam, DG | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Yu, J | ko |
| dc.contributor.author | Choi, H | ko |
| dc.contributor.author | Bae, K | ko |
| dc.contributor.author | Lee, C | ko |
| dc.date.accessioned | 2010-05-19T09:13:22Z | - |
| dc.date.available | 2010-05-19T09:13:22Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-05 | - |
| dc.identifier.citation | IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219 | - |
| dc.identifier.issn | 0740-7475 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/18490 | - |
| dc.description.sponsorship | IEEE Circuits and Systems Sociedty | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE COMPUTER SOC | - |
| dc.title | Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000237777800006 | - |
| dc.identifier.scopusid | 2-s2.0-33744524127 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 23 | - |
| dc.citation.beginningpage | 212 | - |
| dc.citation.endingpage | 219 | - |
| dc.citation.publicationname | IEEE DESIGN & TEST OF COMPUTERS | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kam, DG | - |
| dc.contributor.nonIdAuthor | Yu, J | - |
| dc.contributor.nonIdAuthor | Choi, H | - |
| dc.contributor.nonIdAuthor | Bae, K | - |
| dc.contributor.nonIdAuthor | Lee, C | - |
| dc.type.journalArticle | Article | - |
- Appears in Collection
- EE-Journal Papers(저널논문)
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