On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via)
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Junso | - |
| dc.contributor.author | Kim, Joungho | - |
| dc.date.accessioned | 2010-05-11T08:23:09Z | - |
| dc.date.available | 2010-05-11T08:23:09Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-05-14 | - |
| dc.identifier.citation | 2009 Korea-Japan Joint Conference, v., no., pp.139 - 142 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/18216 | - |
| dc.description.sponsorship | This work was supported by the Brain Korea 21 project [the School of Information Technology, KAIST in 2009] and Advanced Design Team of Hynix Semiconductor Inc.. | en |
| dc.language | ENG | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via) | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 139 | - |
| dc.citation.endingpage | 142 | - |
| dc.citation.publicationname | 2009 Korea-Japan Joint Conference | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Park, Junso | - |
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