학위논문(석사) - 한국과학기술원 : 신소재공학과, 2013.2, [ vii, 57 p. ]
블랙패드; 무전해 니켈/치환 금도금; 이종접촉금속부식; Black pad; Electroless nickel immersion gold (ENIG) process; Micro-galvanic corrosion; nder bump metallurgy (UBM); 하부금속 층
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