DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | Yu, Jin | - |
dc.contributor.advisor | 유진 | - |
dc.contributor.author | Kim, Sung-Hwan | - |
dc.contributor.author | 김성환 | - |
dc.date.accessioned | 2013-09-12T04:42:16Z | - |
dc.date.available | 2013-09-12T04:42:16Z | - |
dc.date.issued | 2012 | - |
dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487114&flag=dissertation | - |
dc.identifier.uri | http://hdl.handle.net/10203/181946 | - |
dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ viii, 96 p. ] | - |
dc.language | eng | - |
dc.publisher | 한국과학기술원 | - |
dc.subject | Solder | - |
dc.subject | Kirkendall void | - |
dc.subject | Diffusion | - |
dc.subject | AES | - |
dc.subject | 커켄달 보이드 | - |
dc.subject | 솔더 | - |
dc.subject | 확산 | - |
dc.subject | 오제분광기 | - |
dc.subject | 재결정 | - |
dc.subject | Recrystallization | - |
dc.title | Effects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints | - |
dc.title.alternative | 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구 | - |
dc.type | Thesis(Ph.D) | - |
dc.identifier.CNRN | 487114/325007 | - |
dc.description.department | 한국과학기술원 : 신소재공학과, | - |
dc.identifier.uid | 020085029 | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.localauthor | 유진 | - |
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