Effects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints = 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구

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dc.contributor.advisorYu, Jin-
dc.contributor.advisor유진-
dc.contributor.authorKim, Sung-Hwan-
dc.contributor.author김성환-
dc.date.accessioned2013-09-12T04:42:16Z-
dc.date.available2013-09-12T04:42:16Z-
dc.date.issued2012-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=487114&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/181946-
dc.description학위논문(박사) - 한국과학기술원 : 신소재공학과, 2012.2, [ viii, 96 p. ]-
dc.languageeng -
dc.publisher한국과학기술원-
dc.subjectSolder-
dc.subjectKirkendall void-
dc.subjectDiffusion-
dc.subjectAES-
dc.subject커켄달 보이드-
dc.subject솔더-
dc.subject확산-
dc.subject오제분광기-
dc.subject재결정-
dc.subjectRecrystallization-
dc.titleEffects of the Kirkendall Voiding on the Interfacial Reactions between Pb-free Solders and Electroplated Cu Film and Suppression of the Kirkendall Voiding in the Solder Joints = 전기도금된 구리와 무연솔더의 접합에서 Kirkendall void가 계면 반응에 미치는 영향과 Kirkendall void의 억제에 관한 연구-
dc.typeThesis(Ph.D)-
dc.identifier.CNRN487114/325007 -
dc.description.department한국과학기술원 : 신소재공학과, -
dc.identifier.uid020085029-
dc.contributor.localauthorYu, Jin-
dc.contributor.localauthor유진-
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