DC Field | Value | Language |
---|---|---|
dc.contributor.author | KIM, HY | ko |
dc.contributor.author | Im, Seyoung | ko |
dc.date.accessioned | 2010-04-29T05:28:33Z | - |
dc.date.available | 2010-04-29T05:28:33Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1994-02 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, v.40, no.1, pp.47 - 54 | - |
dc.identifier.issn | 0098-3063 | - |
dc.identifier.uri | http://hdl.handle.net/10203/18000 | - |
dc.description.abstract | Finite element analysis is performed for the purpose of calculating the landing shift of electron beams due to thermal deformations of a shadow mask. For realistic finite element analysis, firstly the apparent thermal conductivity and the apparent elastic modulus are calculated, and the shadow mask is modeled as shell without slits. Next the finite element formulation is developed for transient thermo-elastic deformation of the shadow mask, wherein thermal radiation is a major heat transfer mechanism. The simulation results are in good agreement with the test results, and this suggests that the present finite element scheme may be efficiently used for thermal deformation design of a shadow mask. | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | ANALYSIS OF BEAM LANDING SHIFTS DUE TO THERMAL DEFORMATIONS OF A SHADOW MASK | - |
dc.type | Article | - |
dc.identifier.wosid | A1994MZ56100007 | - |
dc.identifier.scopusid | 2-s2.0-0028380961 | - |
dc.type.rims | ART | - |
dc.citation.volume | 40 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 47 | - |
dc.citation.endingpage | 54 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON CONSUMER ELECTRONICS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Im, Seyoung | - |
dc.contributor.nonIdAuthor | KIM, HY | - |
dc.type.journalArticle | Article | - |
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