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| 62 | A Comparative Study on the Estimation of Corrosion Resistance of Anti-Fingerprint Steel for Home Applications by Using Salt Spray Test and Electrochemical Impedance Spectroscopy Pyun, Su Il, Eurocorr 2004, pp.1 - 9, 2004 |
| 63 | A Conical-Shape Ag Nanoparticle Array for Localized Surface Plasmon Resonance Biosensor via Block Copolymer Lithography Kim, Sang Ouk, 2010 춘계총회 및 연구논문발표회, 고분자학회, 2010-04-08 |
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| 65 | A correlation between thermal stability of PDP phosphors and their crystal structures Jeon, Duk Young; Im, WB, 13th International Display Workshops, IDW '06, pp.1227 - 1228, 2006-12-06 |
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| 70 | A Direct Determination of Resistance and Capacitances for Polysilicon Emitter Bipolar Transistors using Simple Expressions of Z Parameters Sang-Won Kang, Proc. of 3rd ICVC, pp.420 - 423, 1993 |
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| 73 | A Facile Route to Structural Design of Zinc Stannate (Zn2SnO4) Nanofibers and Functionalization with Co-Catalysts for High Performance Acetone Sensor Cho, Hee-Jin; Kim, Il-Doo, 2018 MRS Fall Meeting & Exhibit, Materials Research Society, 2018-11-26 |
| 74 | A Facile Synthesis of Highly Stable 2H-MoS2 Dispersion and Its Application for Humidity Sensing Application for Humidity Sensing Sim, Dong Min; Han, Hteukjin; Yim, Soonmin; Jung, Yeon Sik, 2016 MRS fall, Materials reserach society, 2016-12-01 |
| 75 | A First principles investigation of new cathode materials for advanced lithium batteries No, Kwangsoo, International Conference on Electroceramics 2005, v.0, no.0, pp.0 - 0, International Conference on Electroceramics 2005, 2005 |
| 76 | A First-principles Study on NASICON-type solid electrolyte LiZr2(PO4)3 for Lithium rechargeable batteries Kisuk Kang, Advaced Electrochmical Energy symposium, 2011-12-29 |
| 77 | A Flash-Based Cu Conductor on Display Glass Substrates for µLED Application Shin, Jung Ho; Lee, Seung Hyung; Lee, Keon Jae, The 22nd International Meeting on Information Display (IMID 2022), The Korean Information Display Society, 2022-08-25 |
| 78 | A fluxless flip chip bonding for VCSEL arrays using silver coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HH; Jeon, Duk Young, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.110 - 116, 2004-01-05 |
| 79 | A Fracture Mechanics Analysis of Popcorn Cracking in the Plastic IC Packages Yu, Jin; Park, YB, IEEE/CPMT Int. Elec. Manuf. Tech. Symp., pp.12 - 19, 1997-01-01 |
| 80 | A Half-Microon Super Self-Aligned BiCMOS Technology for High Spped Application Jeon, Duk Young; Liu, TM; Chin, GM; Morris, MD; Archer, VD; Kim, HH; Cerullo, M; et al, Technical Digest of 1992 IEDM Meeting, pp.23 - 26, 1992 |
