Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 5681 to 5700 of 6494

5681
Use of the THERMO-CALC Software and Database for Alloy Design of High-Strength Steels

Lee, Hyuck Moresearcher; Grujicic, M; Allen, SM, An International Conference on User Applications of Alloy Phase Diagrams, pp.195 - 201, 1986-10-04

5682
Utilization of antiferromagnetic electrodes in magneto-thermoelectric device for large area application

Kim, D; Lee, K; Park, Byong-Gukresearcher, International conference of magnetism, International Union of pure and applied physics, 2015-07-09

5683
V- microalloying 중-탄소 강의 동적 재결정 kinetics와 유동곡선 모델링 연구

김관욱; 홍도형; 박중근, 2014 대한금속재료학회 추계학술대회, 대한금속재료학회, 2014-10-24

5684
Vacancies as Hydrogen Trap Sites in Pure Iron

변수일, Korean Corros. Sci. Soc., pp.12 - 12, 1984

5685
Variation of Fracture Mode in Temper Embrittled 2.25Cr-1Mo Steel

Yu, Jinresearcher, pp.13 - 24, 1983-04-01

5686
Various excitation phenomena of a skyrmion in ultrathin magnetic nanodisk induced by Spin Hall Effect

Shiino, T; 이기석; 박병국researcher, 한국자기학회 하계 학술대회, 한국자기학회, 2015-05-28

5687
Vertically Aligned Nickel Nanowire/Epoxy Composite for Electrical and Thermal Conducting Material

Lee, Hyeong-Gi; Paik, Kyung-Wookresearcher, The 62nd Electronic Components and Technology Conference, 2012-05

5688
Vertically oriented TiO2 nanotube arrays prepared by anodic oxidation

Yang D.-J.; Kim, Ho Giresearcher; Cho S.-J.; Choi W.-Y., 2006 IEEE Nanotechnology Materials and Devices Conference, NMDC, pp.442 - 443, 2006-10-22

5689
Via filling for System in Packaging by using IMP, PVD, CVD, ALD and Electroplating

Lee, Won-Jongresearcher; Cho, BH; Moon, JS, Pan Pacific Microelectronics Symposium, 2006-01-17

5690
Via filling for system in packaging by using ionized metal plasma PVD and electroplating

Lee, Won-Jongresearcher; Cho, Byung Hoon, Kyoto Joint Symposium on Materials Science and Engineering for the 21st Century, pp.88 - 88, 2004

5691
Virus-Directed Design of Barium Titanate for Flexible Piezoelectric Energy Harvester

정창규; 김인수; 남윤성researcher; 이건재researcher, 2014년 한국고분자학회 춘계학술대회, 한국고분자학회, 2014-04-11

5692
Voltage Control of Magnetization Easy-Axes: A Potential Candidate for Spin Switching in Future Ultrahigh-Density Nonvolatile Magnetic Random Access Me

No, Kwangsooresearcher; Kim, Sang-Koog; Shin, Sung-Chul, 9th joint MMM-intermag conference , pp.0 - 0, 2004-01-06

5693
V계 BCC 수소저장합금의 수소저장 특성에 미치는 Mn첨가의 효과

이재영, 춘계 한국수소에너지 학회, 2001

5694
W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis

Kim, Eomji; Cho, Eun Aeresearcher, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01

5695
W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동

강병철; 류호진researcher; 홍순형researcher, 추계분말야금학회, 분말야금학회, 2015-11-05

5696
W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계

백승헌; 조순하; 조영훈; 박병국researcher, 2015 동계학술대회, 한국 자기학회, 2015-11-27

5697
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wookresearcher; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 2008-12-09

5698
Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

5699
Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

5700
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wookresearcher, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

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