Browse "Dept. of Materials Science and Engineering(신소재공학과)" byTypeConference

Showing results 5601 to 5620 of 6618

Thermal Properties of High Volume Fraction SiC Particle Reinforced Al Matrix Composites

Hong, Soon-Hyungresearcher, pp.341 - 346, 2000-01-01

Thermal spin current originated from spin Nernst effect in ferromagnet/heavy metal bilayer structures

Kim, Dong Jun; C. Jeon; Park, Byong-Gukresearcher, Intermag Dublin 2017, International Union of pure and applied physics, 2017-04-25

Thermal spin-orbit torque induced by spin Nernst effect in W/CoFeB/MgO structures

Kim, jeongmok; Kim, Dongjun; Park, Byong-Gukresearcher, 14th Joint MMM-Intermag Conference, IEEE Magnetic Society, 2019-01-16

Thermal stability at the anisotropic conductive films (ACFs) / organic solderability preservatives (OSPs) interface

Kim, I; Kim, HJ; Paik, Kyung-Wookresearcher, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19

Thermal stability of (Sr1-x,Bax)3MgSi 2O8:Eu2+ phosphor for plasma display panel applications

Im, WB; Kim, YI; Jeon, Duk Youngresearcher, 44th International Symposium, Seminar, and Exhibition, SID 2006, pp.554 - 557, 2006-06-04

Thermal Stability of RuO2 and thin films in the Various ambients

Kim, Ho Giresearcher, IUMRS-ICEM, pp.131 - 131, 1998-01-01

Thermal stability study of Eu2+-doped BaAl2Si 2O8 phosphor using polymorphism for plasma display panel applications

Im, WB; Kim, YI; Jeon, Duk Youngresearcher, 5th International Meeting on Information Display, pp.1568 - 1571, Korean Information Display Society, 2005-07-19

Thermal Stability Study of Eu2+-doped BaAl2Si2O8 Phosphor using its Polymorphism for Plasma Display Panel applications

Jeon, Duk Youngresearcher; Im, WB; Kim, YI, 2005 GIST/KAIST/Kyoto/Tohoku university joint symposium, pp.32 -, 2005

Thermal-Wave Imaging of Ceramic/Metal Boundaries and of Voids in Low and High Thermal Conductivity Ceramics

No, Kwangsooresearcher; McClelland, John F, Review of Progress in Quantative Nondestructive Evaluation, pp.263 - 272, 1988

Thermally Resistant Robust Metal Nanowire-embedded Glass-fabric Reinforced Hybrimer Films for Transparent Conductive Films

Bae, Byeong-Sooresearcher; Im, Hyeon-Gyun; Lee, Jaemin; Jung, Su-Ho; Kim, Hwea-Yoon; Lee, Jung-Yong; Kim, Il-Doo, 2013 International Meeting on Information Display, IMID, 2013-08

Thermally Robust 3D Metal Oxide Nano-architecture Containing Various Catalyst Components for Ultra-selective Gas Sensor

Han, Hyeuk Jin; Jung, Yeon Sikresearcher; Lee, Gyu Rac, International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2018), The Korean Institute of Metals and Materials, 2018-11-12

Thermally Soldered Au Nanogrids with Enhanced Plasmon Quality for Quantitative Multiplexing of Trace-Amount Molecules via SERS

Cho, Seung Hee; Jung, Yeon Sikresearcher, 2019 MRS Spring Meeting and Exhibit, Materials Research Society, 2019-04-23

Thermally Stable Photo-Curable Cyclo-aliphatic Epoxy hybrid Material for White LED Encapsulant

배병수researcher; SeungCheol Yang; Seung-Yeon Kwak; Joon-Soo Kim, 2011년도 추계 고분자학회, 한국고분자학회, 2011-10

Thermally stable Sol-Gel derived siloxane hydrid material for light emitting diode (LED) encapsulation

Bae, Byeong-Sooresearcher; Bae, Junyoung; Kim, Yongho; Kim, Hwea-yoon, 2013 International Sol-Gel Conference, ISGS, 2013-08

Thermally stable transparent sol-gel siloxane hybrid materials for LED encapsulants

Bae, Byeong-Sooresearcher; Kim, J; Yang, S, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산

박상희; 박중근researcher, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000

Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection

Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wookresearcher, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01

Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process

Yu, Jinresearcher; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001

Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate

백경욱researcher, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01

Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, Kyung-Wookresearcher; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, 1998-04-01



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