Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 5021 to 5040 of 7308

5021
Relaxation of Crack Tip Stresses by Diffusive Growth of Frain Boundary Cavities

Yu, Jin; Jeon, JY, Proc. 5th Int. Conf. Strength of Materials(ICSMA-5), (The Japan Institute of Metals), pp.611 - 614, 1994-06-01

5022
Relaxation of phosphor screen characteristics of low voltage CL display devices

Jeon, Duk Young, pp.489 -, 2002-01-29

5023
Relaxation of remanent polarization in PZT thin film capacitors

Lee, Won-Jong, ISAF XIII, ISIF XIV, FMA XIX, pp.372 - 372, 2002-05-01

5024
Relaxation of remnant polarization in PZT thin film capacitors

Lee, Won-Jong; Lee, KW, International Joint Conference on the Applications of Ferroelectrics 2002, 2002-05-28

5025
Relaxing Interfacial Dipole by Inducing PEDOT:PSS in Colloidal Quantum Dot Photovoltaics to Improve Efficiency

Lim, Hunhee; Jung, Yeon Sik, 2016 IUPAC-PSK40, 한국고분자학회, 2016-10-06

5026
Release of Trapped electrons and Related Charge Transport Properties in Al-Doped ZnO-Multi-Wall Carbon Nanotube Nanocomposite

Lee, JeongYong; Nam, WH; Kim, BB; Seo, SG; Lim, YS; Seo, WS; Park, HH, 2013 Materials Research Society Fall Meeting, Materials Research Society, 2013-12-02

5027
Reliability analysis of 3D CSP MEMS and IC under thermal cycle-impact coupled multi-physics loads

Zhang, Shuye; Xu, Jianhao; Zhang, Shang; He, Peng; Sun, Mingjia; Yang, Jianqun; Li, Xingji; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), IEEE, 2021-06

5028
Reliability Characteristics of the Thin Interlevel Poly Silicon Oxide for EEPROM Device

Sang-Won Kang, ESC, Extended Abstract, pp.241 -, 1987

5029
Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS)

Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26

5030
Reliability Improvement Methods of Solder Anisotropic Conductive Film (ACF) Joints Using Morphology Control of Solder ACF Joints

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Ji-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-29

5031
Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joints by Controlling ACF Polymer Resin Properties

Kim, Yoo-Sun; Kim, Seung-Ho; Shin, Jiwon; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

5032
Reliability Studies on GE High Density Interconnect(HDI) Modules

Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.71 - 76, MRS, 1994-03-01

5033
Reliable Anisotropic Conductive Adhesives Flip Chip Technology on Organic Substrates for High Frequency Applications

Paik, Kyung-Wook; Yim, MJ; Kwon, WS, The 6th International Symposium on Microelectronics and Packaging, pp.0 - 0, 2001-04-01

5034
Reliable artificial leaky integrate and fire (LIF) neuron device using 2D material

Ahn, Wonbae; Ham, Ayoung; Oh, Jungyeop; Kang, Kibum; Choi, Sung-Yool, The 12th International Workshop on 2D Materials (A3 Workshop), Nanjing university, 2023-07-20

5035
Reliable Memristive Switching Behavior Directed by Locally-Concentrated Electric Field from Densely-Packed Silver Nanocone Arrays

You, Byoung Kuk; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-17

5036
Remarkable Rate Capability and Cycling Stability of Li-Sulfur Battery with Tin Sulfide Modified Separator

Moorthy, Brindha; 권순호; 김주형; Ragupathy, P; 이혁모; 김도경, 2019년 한국세라믹학회 춘계학술대회, 한국세라믹학회, 2019-04-11

5037
Repassivation Kinetics and Stress Corrosion, resistance and Phase transformations of 14Cr-3Mo martensitic stainless steels

권혁상, 한국부식방식학회 추계학술대회, pp.0 - 0, 한국부식방식학회, 2005-11-01

5038
Repassivation Kinetics of Fe-20Cr-xNi Alloys (x = 0∼80 wt%) and Its Relation to Stress Corrosion Susceptibility

Cho, Eun-Ae; Kwon, HS., Asian-Pacific Corrosion Control Conference , Asian-Pacific Corrosion Control Conference, 2001-10-07

5039
Repassivation kinetics of Fe-20Cr-xNi alloys (x=0~80 wt%) and its relation to stress corrosion susceptibility

Kwon, Hyuk-Sang; Cho, Eun Ae, Asian-Pacific Corrosion Control Conference, 2001

5040
Repassivation kinetics of Fe-20Cr-xNi alloys (x=0~80%) and Its relationship with stress corrosion susceptibility

Kwon, Hyuk-Sang; Cho, Eun Ae, international meeting of the electrochemical society, ECS, 2001

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