Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 3581 to 3600 of 7308
| Intrinsic stress measurements in CVD diamond films Yu, Jin; Kim, JG; Sohn, YC; Lee, YS, Symposium-Amorphous and Nanoestructured Carbon, pp.471 - 476, MRS, 1999-11-29 |
| Intrinsically Stretchable Biochemical Sensor to Monitor Multi Analytes in Sweat and ECG via Ag Flake Conductor 김승완; 이원령; 배병수, 2020 한국세라믹학회 추계학술대회, 한국세라믹학회, 2020-11-25 |
| Intrinsically Stretchable Electrode Encapsulated by Photo-patternable PDMS to Monitor ECG Signal Kim, Seungwan; Lee, Wonryung; Bae, Byeong-Soo, 2019 한국세라믹학회 추계 학술대회, 한국세라믹학회, 2019-11 |
| Introducing Iridium Nanosheet Catalysts on Titanium Oxide for Oxygen Evolution Reaction in PEMWE Shin, DongWon; Lee, SangJae; Bak, Junu; Roh, Jeonghan; Lee, KwangHo; Chang, HyunWoo; Lee, Hyein; et al, International Conference on Electrolysis, ICE 2023, North-West University, 2023-08-27 |
| Introduction and Application of Aberration-corrected Transmission Electron Microscopy Yuk, Jong Min, ICAE 2017, The Korean Institute of Electrical and Electronic Material Engineers, 2017-11-23 |
| Inverstigation of Passivity Breakdown on Ni Based on the Point Defect Model Kwon, Hyuk-Sang, the International Society of Electrochemistry, pp.0 - 0, 2004-03-01 |
| Inverstigation on the Initiation of Pitting Corrosion of 409L Stainless Steel by Micro-probe Technique Kwon, Hyuk-Sang, the International Society of Electrochemistry, pp.0 - 0, 2004-03-01 |
| Investgation of the Grain Boundary Cracking Mechanism of Cyclic Creep for an Al-4at.%Mg Solid Solution Alloy Nam, Soo Woo, FEFG/ICF Int'l Conf. on Fract. of Eng. Mat. & Struc., 1991 |
| Investigating Optogenetically Induced Absence Seizure through Flexible Multi-Electrode Array Sin, Jeongho; Lee, Seung Hyun; Lee, Haneol; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-17 |
| Investigation and Fabrication of High Thermal Conductivity Silicon Nitride Ceramics Lee, Hyun Min; Kong, Jung Hoon; Kim, Do Kyung, Materials Science & Technology conference, MS&T 21, The American Ceramic Society / The Association for Iron & Steel Technology / The Minerals, Metals & Materials Society, 2021-10-22 |
| Investigation of (001) c-textured CaRuO3-ζ thin films directly on (100) Si substrate: Growth, transport properties, and their electronic states 노광수; 황호성; 백한종, 한국재료학회 추계학술발표대회, pp.0 - 0, 한국재료학회, 2005-11-10 |
| Investigation of a2 Phase Transformation Mechanism Under the Interaction of Dislocation with Lamellar Interface Nam, Soo Woo, International Conference on Structural & Functional Intermetallics, 2000 |
| Investigation of Anisotropic Crystal Growth Mechanism of Rutile TiO2 in Molten Salt Marelign, Beyene Anteneh; Lee, Hyun Min; Kim, Do Kyung, 2016년도 한국재료학회 추계학술대회 및 한일 재료공학 심포지엄, 한국재료학회, 2016-11-18 |
| Investigation of Au Nanoparticles Catalytic Effects on Metal oxide for Gas Sensing with Highly Sensitive and Selective Gas Sensor Array 이진호; 전석우, 2021년도 대한금속재료학회 추계학술대회, 대한금속재료학회, 2021-10-21 |
| Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding Kim, Myeongeun; Kang, Sukkyung; Kim, Sanha; Kim, Kyung Min, The 7th International Conference on Advanced Electromaterials, ICAE 2023, International Conference on Advanced Electromaterials(ICAE), 2023-11-02 |
| Investigation of domain switching and retention property of PbTiO3 films using atomic force microscopy No, Kwangsoo; Park, Moon Kyu; Kim, Yu Seok; Kim, Ji Yoon; Bhalmann, Simon; Hong, Seung Bum; Kim, Yong Kwan, Joint Symposium on Materials Science and Engineering for 21th Century, 2007-10-21 |
| Investigation of effect of oxide and nitride on initiation of pitting corrosion in ferritic stainless steel by micro-droplet cell Ha, H; Kwon, Hyuk-Sang; Park, C, 2004 Joint International Meeting - 206th Meeting of the Electrochemical Society/2004 Fall Meeting of the Electrochemical Society of Japan,, pp.700 - 700, 2004-10-03 |
| Investigation of electric field effect on perpendicular magnetic anisotropy with MTJ structures 박경웅; 서수만; 정성웅; 박병국, 2015 동계학술대회, 한국 자기학회, 2015-11-27 |
| Investigation of electroplated Ni and Ni-Cu alloy UBM (Under Bump Metallurgy) with lead-free solders for flip chip packages Kim, SH; Kim, JY; Yu, Jin, 2002 International Symposium on Microelectronics, v.4931, pp.251 - 255, 2002-09-04 |
| Investigation of elemental distributions for Al0.1(Fe1+xCoCr1-xMn)0.9 (x=0, 0.2, 0.4, 0.6) high entropy alloys for soft magnetic materials JUNG, Chanwon; Marshal, A; Pradeep, K. G; Choi, Pyuck-Pa, 2018 Joint Symposium on Materials Science and Engineering for 21st Century, USTB, 2018-06-25 |
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