Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 5661 to 5680 of 6460

5661
W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis

Kim, Eomji; Cho, Eun Aeresearcher, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01

5662
W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동

강병철; 류호진researcher; 홍순형researcher, 추계분말야금학회, 분말야금학회, 2015-11-05

5663
W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계

백승헌; 조순하; 조영훈; 박병국researcher, 2015 동계학술대회, 한국 자기학회, 2015-11-27

5664
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wookresearcher; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 2008-12-09

5665
Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

5666
Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

5667
Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wookresearcher, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

5668
Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wookresearcher, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

5669
Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wookresearcher; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 2007-01-15

5670
Wafer to wafer bonding using electroplated Co-Sn solder layer

Kim, SH; Yu, Jinresearcher, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 2008-10-22

5671
Water Oxidation Mechanism for Co-containing Polyoxometalate

권순호; 신기현; 류명신; 이혁모researcher, 2014년 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2014-04-25

5672
Waterproof Flexible GaN LED on a Liquid Crystal Polymer Substrate Applicable to Implantable Biomedical Field

Lee, Jaehui; Lee, Keon Jaeresearcher, The 18th International Meeting on Information Display, The Korean Information Display Society (KIDS), 2018-08-29

5673
Waveguide and Optical Modulation characteristics of Sol-Gel Derived (Pb, La)TiO3 Slab Waveguides

No, Kwangsooresearcher, Inter. Sympo. on Applications of Ferroelectric Thin Films, 1996-01-01

5674
Waveguide Sharacteristics of Sol-Gel Derived PLT thin FIlms

No, Kwangsooresearcher; Yoon, DS; Koo, JM; Bae, BS; Lee, WJ; Jiang, ZT; Sung, TH; et al, The 2nd International Meeting of Pacific Rim Ceramic Societies, 1996-01-01

5675
Waveguiding and optical modulation characteristics of sol-gel derived (Pb, La)TiO3 slab waveguides

No, Kwangsooresearcher; Yoon, DS; Koo, JM; Bae, BS; Lee, WJ; Jiang, ZT; Sung, TH; et al, International Symposium on Applications of Ferroelectric Thin Films, 1996

5676
Wavelength Dependent Photosensitivity in a Ge-Doped Sol-Gel Hybrid Material for Designing Micro-structures

Bae, Byeong-Sooresearcher; Kim, JK; Kang , DJ, 13th international workshop on sol-gel science and technology, 2005

5677
Wavelength Dependent Photosensitivity in Ge-Doped Sol-Gel Hybrid Material for Direct Photo-Patterning

배병수researcher; 김진기; 강동준, 한국세라믹학회, 한국세라믹학회, 2005

5678
WDS로 측정한 다성분계 박막 조성의 이론적인 보정 및 두께 계산: PZT 및 PLZT계 박막에의 응용

이원종researcher; 변경문, 한국재료학회 춘계학술연구발표회, pp.0 - 0, 1997-01-01

5679
Wear-Enhanced Hydrogen Evolution in Mild Steel

변수일, Korean Corros. Sci. Soc., pp.12 - 12, 1985

5680
Wear-Enhanced Hydrogen Evolution in Mild Steel by Electrochemical Techniques

변수일, Korean Corros. Sci. Soc., pp.19 - 19, 1985

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