Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject failure mode

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Adhesion behavior of CuCr alloy/polyimide films under 350 degrees C and 85 degrees C/85% RH environments

Ahn, EC; Yu, Jinresearcher; Park, IS; Lee, Won-Jongresearcher, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.10, no.12, pp.1343 - 1357, 1996-04

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