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Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM) Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07 |
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