Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject eutectic 80 gold-20 tin solder
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| Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11 |
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