| 1 | (A) study on the new manufacturing process for flexible printed circuit board (PCB) and the effects of copper oxide on mechanical reliability of Cu/PI interface = 다층 연성기판의 제조 공정 및 구리산화물이 구리/폴리이미드 계면의 신뢰성에 미치는 영향에 관한 연구link Lee, Hyuek-Jae; 이혁재; et al, 한국과학기술원, 2006 |
| 2 | Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07 |
| 3 | Adhesion behaviours of hepatocytes cultured onto biodegradable polymer surface modified by alkali hydrolysis process Nam, YoonSung; Yoon, JJ; Lee, JG; Park, TG, JOURNAL OF BIOMATERIALS SCIENCE-POLYMER EDITION, v.10, no.11, pp.1145 - 1158, 1999 |
| 4 | Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
| 5 | Coating of tetraethylorthosilicate (TEOS) vinyltriethoxysilane (VTES) hybrid solution on polymer films Eo, YJ; Kim, DJ; Bae, Byeong-Soo; Song, KC; Lee, TY; Song, SW, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.13, no.1-3, pp.409 - 413, 1998-11 |
| 6 | Effect of the microstructureOf Si3N4 on the adhesion strength of TiN film on Si3N4 Kim, YG; Tatami, J; Komeya, K; Kim, Do Kyung, THIN SOLID FILMS, v.510, pp.222 - 228, 2006-07 |
| 7 | Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries Kim, Ryoung-Hee; Han, Dong-Wook; Nam, Do-Hwan; Kim, Jeong-Han; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.157, no.5, pp.269 - 273, 2010 |
| 8 | Enhancement of adhesion strength of electroless-plated Ni under bump metallurgy by introduction of inductively coupled plasma enhanced bias sputtering Ni seed layer Kim, ED; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.44, no.50-52, pp.1541 - 1543, 2005-12 |
| 9 | Highly reliable flip-chip-on-flex package using multilayered anisotropic conductive film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.76 - 82, 2004-01 |
| 10 | Ionized metal plasma(IMP) sputter system을 이용해 증착한 Cu/Ta(N) 박막의 접착특성 및 확산방지특성에 대한 연구 = Adhesion and diffusion barrier properties of Cu/Ta(N) films fabricated by IMP sputteringlink 김용철; Kim, Yong-Chul; et al, 한국과학기술원, 2007 |
| 11 | UBM용 Ni 박막 형성 및 특성에 관한 연구 = Fabrication and characterization of the Ni films for the Applications to UBMlink 김응도; Kim, Eung-Do; et al, 한국과학기술원, 2005 |
| 12 | 플라즈마 표면처리에 의한 폴리카보네이트의 표면에너지 및 구리박막과의 접착력 변화에 관한 연구 조병훈; 이원종; 박영호, 한국재료학회지, v.15, no.11, pp.745 - 750, 2005-11 |
