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공정 80Au-20Sn 솔더 합금과 Under Bump Metallurgy(UBM)의 계면 현상 및 계면 생성물의 성장거동에 대한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between eutectic 80Au-20Sn solder alloy and under bump metallurgylink

김성수; Kim, Sung-Soo; et al, 한국과학기술원, 2005

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