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Showing results 1 to 10 of 10

1
CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

2
Effect of electromigration on mechanical shear behavior of flip chip solder joints

Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03

3
Effects of reactive diffusion on stress evolution in Cu-Sn films

Song, JY; Yu, Jin; Lee, TY, SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170, 2004-07

4
Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering

Kim, J. Y.; Yu, Jin, APPLIED PHYSICS LETTERS, v.92, no.9, 2008-03

5
Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure

Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01

6
Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints

Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12

7
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study

Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01

8
Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps

Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11

9
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08

10
(UBM)Under bump metallurgy study for Pb-free bumping

Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05

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