Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject ADHESIVES
Showing results 1 to 7 of 7
| A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications Zhang, Shuye; Lin, Tiesong; He, Peng; Zhao, Ning; Huang, Mingliang; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.12, pp.2087 - 2094, 2017-12 |
| A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.3, pp.383 - 391, 2018-03 |
| ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; Paik, Kyung-Wook; Roshanghias, Ali, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01 |
| Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09 |
| Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications Yim, MJ; Ryu, W; Jeon, YD; Lee, J; Ahn, Seungyoung; Kim, Joungho; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.22, no.4, pp.575 - 581, 1999-12 |
| Silver-Polydopamine Hybrid Coatings of Electrospun Poly(vinyl alcohol) Nanofibers Son, Ho Yeon; Ryu, Ji Hyun; Lee, Haeshin; Nam, YoonSung, MACROMOLECULAR MATERIALS AND ENGINEERING, v.298, no.5, pp.547 - 554, 2013-05 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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