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Showing results 1 to 7 of 7

1
A Study on Transmission properties of AuNi coated polymer ball joint and Sn58Bi solder joint for flex-on-board interconnection

Zhang, Shuye; Park, Junyong; Park, Gapyeol; Kim, Joungho; Paik, Kyung-Wook; He, Peng, JOURNAL OF ADVANCED JOINING PROCESSES, v.5, 2022-06

2
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

3
Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100-mu m-Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method

Park, Jae-Hyeong; Kim, Tae Wan; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.7, pp.1127 - 1134, 2016-07

4
Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films

Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04

5
Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

Kim, Tae-Wan; Suk, Kyung-Lim; Lee, Sang-Hoon; Paik, Kyung-Wook, JOURNAL OF NANOMATERIALS, 2013

6
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)

Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06

7
Ultrasonic-Assisted Thermocompression Bonding Method of Solder Anisotropic Conductive Film Joints for Reliable Camera Module Packaging

Kim, Yoo-Sun; Kim, Seung-Ho; Lee, Kiwon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.12, pp.2156 - 2163, 2013-12

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