Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject 반도체 패키징▼a팬아웃패널레벨패키징▼a에폭시몰딩컴파운드▼a에폭시몰딩필름
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| (A) study on the material properties and process conditions of epoxy molding films (EMFs) for fan-out panel-level packages (FOPLPs) = 팬아웃패키지를 위한 에폭시 몰딩 필름의 재료 특성과 공정 조건에 대한 연구link Park, Jong Ho; Paik, Kyoung-Wook; et al, 한국과학기술원, 2018 |
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