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1
Creep deformation of lead-free Sn-3.5Ag-Bi solders

Shin, SW; Yu, Jinresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03

2
Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate

Choi, WK; Lee, HyuckMoresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.28, no.11, pp.1251 - 1255, 1999

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