Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 6448 to 6467 of 7308
| W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis Kim, Eomji; Cho, Eun Ae, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01 |
| W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동 강병철; 류호진; 홍순형, 추계분말야금학회, 분말야금학회, 2015-11-05 |
| W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계 백승헌; 조순하; 조영훈; 박병국, 2015 동계학술대회, 한국 자기학회, 2015-11-27 |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 |
| Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 |
| Water Oxidation Mechanism for Co-containing Polyoxometalate 권순호; 신기현; 류명신; 이혁모, 2014년 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2014-04-25 |
| Waterproof Flexible GaN LED on a Liquid Crystal Polymer Substrate Applicable to Implantable Biomedical Field Lee, Jaehui; Lee, Keon Jae, The 18th International Meeting on Information Display, The Korean Information Display Society (KIDS), 2018-08-29 |
| Waveguide and Optical Modulation characteristics of Sol-Gel Derived (Pb, La)TiO3 Slab Waveguides No, Kwangsoo, Inter. Sympo. on Applications of Ferroelectric Thin Films, 1996-01-01 |
| Waveguide Sharacteristics of Sol-Gel Derived PLT thin FIlms No, Kwangsoo; Yoon, DS; Koo, JM; Bae, BS; Lee, WJ; Jiang, ZT; Sung, TH; et al, The 2nd International Meeting of Pacific Rim Ceramic Societies, 1996-01-01 |
| Waveguiding and optical modulation characteristics of sol-gel derived (Pb, La)TiO3 slab waveguides No, Kwangsoo; Yoon, DS; Koo, JM; Bae, BS; Lee, WJ; Jiang, ZT; Sung, TH; et al, International Symposium on Applications of Ferroelectric Thin Films, 1996 |
| Wavelength Dependent Photosensitivity in a Ge-Doped Sol-Gel Hybrid Material for Designing Micro-structures Bae, Byeong-Soo; Kim, JK; Kang , DJ, 13th international workshop on sol-gel science and technology, 2005 |
| Wavelength Dependent Photosensitivity in Ge-Doped Sol-Gel Hybrid Material for Direct Photo-Patterning 배병수; 김진기; 강동준, 한국세라믹학회, 한국세라믹학회, 2005 |
| WDS로 측정한 다성분계 박막 조성의 이론적인 보정 및 두께 계산: PZT 및 PLZT계 박막에의 응용 이원종; 변경문, 한국재료학회 춘계학술연구발표회, pp.0 - 0, 1997-01-01 |
| Wear-Enhanced Hydrogen Evolution in Mild Steel 변수일, Korean Corros. Sci. Soc., pp.12 - 12, 1985 |
| Wear-Enhanced Hydrogen Evolution in Mild Steel by Electrochemical Techniques 변수일, Korean Corros. Sci. Soc., pp.19 - 19, 1985 |
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