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A quantitative analysis of the stress relaxation effect of thermoplastics in multilayer substrates Kim, JS; Paik, Kyung-Wook; Seo, HS, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.22, no.4, pp.638 - 641, 1999-11 |
A study on the adhesion enhancement of polyetherimide to Si wafer using an Al-chelate treatment during multichip module fabrication Ko, HS; Chung, IS; Paik, Kyung-Wook, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY , v.83, no.1-3, pp.111 - 118, 2001-06 |
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