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A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress Park, Yong Cheon; Kim, Taehyun; Shim, Hye Rin; Choi, YoungWoo; Hong, Seungbum; Yoo, Seunghyup; Im, Sung Gap, APPLIED SURFACE SCIENCE, v.598, 2022-10 |
Conformal 3D Nanopatterning by Block Copolymer Lithography with Vapor-Phase Deposited Neutral Adlayer Yang, Geon Gug; Choi, Junhwan; Cha, Seung Keun; Lee, Gil Yong; Jin, Hyeong Min; Hwang, Ho Seong; Yun, Taeyeong; et al, ACS NANO, v.13, no.11, pp.13092 - 13099, 2019-10 |
Direct Observation of a Carbon Filament in Water-Resistant Organic Memory Lee, Byung-Hyun; Bae, Hagyoul; Seong, Hyejeong; Lee, Dong-Il; Park, Hongkeun; Choi, Young Joo; Im, Sung-Gap; et al, ACS NANO, v.9, no.7, pp.7306 - 7313, 2015-07 |
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