Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject coefficient of thermal expansion
Showing results 1 to 4 of 4
| 350°C processable low-CTE transparent glass-fabric-reinforced hybrimer film for flexible substrates Kim, Hwea Yoon; Jin, Jungho; Park, Sang-Hee Ko; Eom, In Yong; Bae, Byeong-Soo, JOURNAL OF INFORMATION DISPLAY, v.16, no.1, pp.57 - 64, 2015-01 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03 |
| Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
| W-20wt%Cu 나노복합재료의 열적 기계적 특성 = Thermal and mechanical properties of W-20wt%Cu nanocompositeslink 이용언; Lee, Yong-Un; et al, 한국과학기술원, 2001 |
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