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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject anisotropic conductive films (ACFs)

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Showing results 1 to 9 of 9

1
A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

2
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07

3
A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-Fine-Pitch Interconnection Applications

Lee, Sang Hoon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.46, no.1, pp.167 - 174, 2017-01

4
Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09

5
Contraction stresses development of anisotropic conductive films (ACFs) flip chip interconnection: Prediction and measurement

Kwon, Woon-Seong; Yang, Se-Young; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.29, no.3, pp.688 - 695, 2006-09

6
Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05

7
Effects of the Types of Anisotropic Conductive Films on the Bending Reliability of Chip-in-Plastic Packages

Kim, Ji-Hyun; Kim, Ji-Hye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.3, pp.405 - 411, 2019-03

8
Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Kwon, WS; Paik, Kyung-Wook, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.24, pp.135 - 142, 2004-04

9
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10

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