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Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject anisotropic conductive film (ACF)

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Showing results 1 to 7 of 7

1
Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish

Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07

2
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications

Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10

3
Effects of epoxy functionality on the properties and reliability of the anisotropic conductive films for flip chips on organic substrates

Hwang, JS; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.1722 - 1727, 2006-09

4
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly

Hwang, JW; Yim, MJ; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.1455 - 1461, 2005-11

5
Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12

6
Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film

Yim, MJ; Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING , v.23, no.3, pp.171 - 176, 2000-07

7
Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Kim, Won-Chul; Lee, Ki-Won; Saarinen, Ilkka J.; Pykari, Lasse; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.884 - 889, 2012-05

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