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Showing results 1 to 4 of 4

1
Effects of pd addition on au stud bumps/Al pads interfacial reactions and bond reliability

Kim, HJ; Cho, JS; Park, YJ; Lee, J; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.33, pp.1210 - 1218, 2004-10

2
Formation mechanism of Y2BaCuO5 pattern in growing YBa2Cu3Ox grains during melt-infiltration process

Jee, YA; Kang, Suk-Joong L; Chung, H, JOURNAL OF MATERIALS RESEARCH, v.13, no.3, pp.583 - 588, 1998-03

3
Mechanisms of subgrain coarsening and its effect on the mechanical properties of carbon-supersaturated nanocrystalline hypereutectoid steel

Li, Y. J.; Kostka, A.; Choi, Pyuck-Pa; Goto, S.; Ponge, D.; Kirchheim, R.; Raabe, D., ACTA MATERIALIA, v.84, pp.110 - 123, 2015-02

4
Self-healing soft electronics

Kang, Jiheong; Tok, Jeffrey B-H; Bao, Zhenan, NATURE ELECTRONICS, v.2, no.4, pp.144 - 150, 2019-04

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