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Showing results 1 to 6 of 6

1
An X-ray study on the mechanical effects of the peel test in a Cu/Cr/polyimide system

Park, IS; Yu, Jin, ACTA MATERIALIA, v.46, no.8, pp.2947 - 2953, 1998-05

2
Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging

Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12

3
Effects of the polymer residues on via contact resistance after reactive ion etching

Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, JOURNAL OF VACUUM SCIENCE TECHNOLOGY B, v.20, no.3, pp.1000 - 1007, 2002

4
Interfacial fracture energy measurements in the Cu/Cr/polyimide system

Park, YB; Park, IS; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.261 - 266, 1999-06

5
STUDIES ON METAL BENZOCYCLOBUTENE (BCB) INTERFACE AND ADHESION

Paik, Kyung-Wook; Cole, Herbert S; Saia, Richard J; Chera, John J, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.7, no.5, pp.403 - 415, 1993

6
Study on the effects of copper oxide growth on the peel strength of copper/polyimide

Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08

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