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Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 mu m technology Lee, Min-Hyung; Kwon, Yong-Min; Pyo, Sung-Gyu; Lee, Han-Choon; Han, Jae-Won; Paik, Kyung-Wook, THIN SOLID FILMS, v.519, no.11, pp.3906 - 3913, 2011-03 |
Kinetics of electromigration-induced edge drift in Al-Cu thin-film interconnects Morris Jr. J.W.; Kim C.U.; Lee, HyuckMo, JOURNAL OF APPLIED PHYSICS, v.82, no.4, pp.1592 - 1598, 1997 |
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