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Showing results 1 to 3 of 3

1
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

2
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11

3
The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics

Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05

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