Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject CU SUBSTRATE
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| Abnormal grain growth of Ni3Sn4 at Sn-33Ag/Ni interface Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.3, pp.710 - 713, 2004-03 |
| Grain morphology of intermetallic compounds at solder joints Choi, WK; Jang, SY; Kim, JH; Paik, Kyung-Wook; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.17, no.3, pp.597 - 599, 2002-03 |
| Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11 |
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